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US Patent Issued to General Electric on Jan. 27 for "Cover plate connections for a hollow fan blade" (New York, Ohio Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,007, issued on Jan. 27, was assigned to General Electric Co. (Evendale, Ohio). "Cover plate connections for a hollow fan blade" was invente... Read More


US Patent Issued to Huawei Technologies on Jan. 27 for "Method, apparatus, and system for accessing LTE network by mobile terminal" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,250, issued on Jan. 27, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Method, apparatus, and system for accessing LTE ne... Read More


US Patent Issued to ALEDIA on Jan. 27 for "3D light-emitting diode and associated manufacturing method" (French Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,617, issued on Jan. 27, was assigned to ALEDIA (Champagnier, France). "3D light-emitting diode and associated manufacturing method" was inv... Read More


US Patent Issued to Hewlett-Packard Development on Jan. 27 for "Object tracking" (Texas Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,587, issued on Jan. 27, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas). "Object tracking" was invented by Guoxing Yang ... Read More


US Patent Issued to Proofpoint on Jan. 27 for "Using a machine learning system to process a corpus of documents associated with a user to determine a user-specific and/or process-specific consequence index" (Utah, North Carolina Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,235, issued on Jan. 27, was assigned to Proofpoint Inc. (Sunnyvale, Calif.). "Using a machine learning system to process a corpus of docume... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,848, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyung... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Augmented reality device and electronic device interacting with augmented reality device" (South Korean Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,757, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Augmented reality device and electronic devi... Read More


US Patent Issued to JIANGSU DONGCHENG TOOLS TECHNOLOGY on Jan. 27 for "Electric drill" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. D1,110,140, issued on Jan. 27, was assigned to JIANGSU DONGCHENG TOOLS TECHNOLOGY Co. LTD (Nantong, China). "Electric drill" was invented by Jian ... Read More


US Patent Issued to NAMICS on Jan. 27 for "Low-voltage varistor, circuit board, semiconductor component package, and interposer" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,591, issued on Jan. 27, was assigned to NAMICS Corp. (Niigata, Japan). "Low-voltage varistor, circuit board, semiconductor component packag... Read More


US Patent Issued to hello sweety on Jan. 27 for "Sugar substitute for baked goods or confectionery" (Swiss Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,532,903, issued on Jan. 27, was assigned to hello sweety ag (Rotkreuz, Switzerland). "Sugar substitute for baked goods or confectionery" was in... Read More